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TABLE OF CONTENTS
INTRODUCTION .......................................................................................................................................................................3
FEATURES............................................................................................................................................................................3~5
SPECIFICATIONS.................................................................................................................................................................6~9
LOCATION OF CUSTOMER CONTROLS .......................................................................................................................10~11
DISASSEMBLY.................................................................................................................................................................12~13
1. CABINET and CIRCUIT BOARD DISASSEMBLY ..........................................................................................................12
1-1. Bottom Chassis..........................................................................................................................................................12
1-2. Front Bezel Assy........................................................................................................................................................12
1-3. Cabinet and Main Circuit Board.................................................................................................................................12
2. MECHANISM ASSY DISASSEMBLY..............................................................................................................................12
2-1. Pick-up Unit................................................................................................................................................................12
2-2. Pick-up ......................................................................................................................................................................13
EXPLODED VIEW.............................................................................................................................................................14~15
MECHANICAL REPLACEMENT PARTS LIST ................................................................................................................16~18
GLOSSARY.............................................................................................................................................................................19
THE DIFFERENCES OF CD-R/CD-RW DISCS AND GENERAL CD-ROM.....................................................................20~26
1. Recording Layer ..............................................................................................................................................................20
2. Disc Specification ............................................................................................................................................................20
3. Disc Materials..................................................................................................................................................................21
4. Reading Process of Optical Disc.....................................................................................................................................22
5. Writing Process of CD-R Disc .........................................................................................................................................23
6. Writing Process of CD-RW Disc......................................................................................................................................23
7. Organization of the PCA, PMA and Lead-in Area ...........................................................................................................24
8. Function of PCA and PMA area ......................................................................................................................................25
9. OPC and ROPC ..............................................................................................................................................................25
10. Writing Process of DISC................................................................................................................................................26
THE DIFFERENCES OF DVD-R/RW, DVD+R/RW DISCS AND DVD-ROM....................................................................27~35
1. Recording Layer ..............................................................................................................................................................27
2. Disc Specification ............................................................................................................................................................28
3. Disc Materials..................................................................................................................................................................28
4. Writing Pulse Waveform of DVD+R.................................................................................................................................31
5. Writing Pulse Waveform DVD+RW .................................................................................................................................33
6. Organization of Inner Drive Area, Outer Drive Area, Lead-in Zone and Lead-out Zone .................................................34
LightScribe MEDIA...........................................................................................................................................................36~39
1. LightScribe Media............................................................................................................................................................36
2. Hardware Block Diagram of LightScribe Label Printing...................................................................................................37
3. MD Assy For LightScribe.................................................................................................................................................38
4. Optical Encoder Assy ......................................................................................................................................................39
DVD & CD DATA PROCESSING......................................................................................................................................40~43
1. Data Processing Flow......................................................................................................................................................40
2. Copy Protection and Regional Code Management Block ...............................................................................................41
3. About Prevention the DVD-ROM from to be copy...........................................................................................................42
4. About the DVD-ROM Regional Code ..............................................................................................................................43
INTERNAL STRUCTURE OF THE PICK-UP....................................................................................................................44~46
1. Block Diagram of the Pick-up(HOP-7632TS) ..................................................................................................................44
2. Pick up Pin Assignment...................................................................................................................................................45
3. Signal detection of the P/U..............................................................................................................................................46
DESCRIPTION OF CIRCUIT.............................................................................................................................................47~53
1. ALPC Circuit....................................................................................................................................................................47
2. Focus Circuit....................................................................................................................................................................49
3. Tracking & Sled Circuit....................................................................................................................................................50
4. Spindle Circuit .................................................................................................................................................................53
MAJOR IC INTERNAL BLOCK DIAGRAM AND PIN DESCRIPTION.............................................................................55~72
TROUBLESHOOTING GUIDE..........................................................................................................................................73~90
BLOCK DIAGRAM ..................................................................................................................................................................91
PRINTED CIRCUIT BOARD DIAGRAM ...........................................................................................................................92~96
ELECTRICAL REPLACEMENT PARTS LIST........................................................................................................................97
CAUTION - INVISIBLE LASER RADIATION WHEN OPEN AVOID EXPOSURE TO BEAM.