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Document No. DER-S0026A 16 Version 1.2 ©2008 DMC Co., Ltd.
TSC-40/IC Product Specification
80 to 150 °C (Package surface temperature)
260 °C max.
10s max. (Primary + Secondary flow
passage duration)
Time
Temperature
110
±
30s
175±15 °C
1 to 4 °C/s
220 °C or above, 60s max.
255 °C or above, 10-16s max.
260 °C max.
Time
Package’s surface temperature
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow)
Frequency: Three times or less
Temperature: The following device surface temperature profile is recommended.
Figure 1: Infrared reflow, air reflow temperature profile
2. Wave soldering method (Flow soldering, solder dip method)
Frequency: One time or less
Temperature: Following temperature profile is recommended (Set the optimal preheat temperature
according to the flux type)
Figure 2: Wave soldering temperature profile
3. Soldering iron (Manual soldering)
Soldering bit’s temperature: 370 °C or lower
Soldering time: Five seconds or less/terminal