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• Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A4
are available. For dual-processor systems, sockets A1 to A4 and sockets B1 to B4 are available.
• Populate all sockets with white release tabs first and then populate the sockets with black release tabs.
• Populate the sockets by highest capacity DIMM in the following order - first-in-sockets with white
release tabs and then black. For example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB
DIMMs in the sockets with white release tabs and 8 GB DIMMs in the sockets with black release tabs.
• In a dual-processor configuration, the memory configuration for each processor must be identical.
For example, if you populate socket A1 for processor 1, then populate socket B1 for processor 2.
• DIMMs of different sizes can be mixed provided other memory population rules are followed (for
example, 4 GB and 8 GB memory modules can be mixed).
• The memory module for DIMM sockets A3, A4, B3, and B4 need to be inserted 180 ° reverse with
regard to the DIMMS in the sockets A1, A2, B1, and B2.
• Follow the mode-specific guidelines to maximize performance. For more information, see Mode-
specific guidelines.
Table 2. Heat sink — processor configurations
Processor
configuration
Processor type (in
Watts)
Heat
sink
width
Number of DIMMs
Maximum system
capacity
Reliability, Availability,
and Serviceability (RAS)
features
Single processor 120 W or 140 W 68
mm
4 4
Dual processor 120 W 68
mm
8 8
Mode-specific guidelines
Four memory channels are allocated to each processor. The allowable configurations depend on the
memory mode selected.
NOTE: x4 and x8 DRAM based DIMMs can be mixed providing support for RAS features. However,
all guidelines for specific RAS features must be followed. x4 DRAM based DIMMs retain Single
Device Data Correction (SDDC) in memory optimized (independent channel) mode. x8 DRAM based
DIMMs require Advanced ECC mode to gain SDDC.
The following sections provide additional slot population guidelines for each mode.
Advanced ECC (Lockstep)
Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This
protects against single DRAM chip failures during normal operation.
Memory installation guidelines:
• Memory modules must be identical in size, speed, and technology.
• DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies
for sockets with black release tabs. This ensures that identical DIMMs are installed in matched pairs -
for example, A1 with A2, A3 with A4 and so on.
Processor Configuration Memory population rules Memory population
information
Single CPU Advanced ECC
(Lockstep)
{1,2},{3,4} Numbers inside the brackets
indicate the slots that must be
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