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Technical Product Specification 3
Intel
®
NetStructure™ ZT 7102 Chassis Management Module
Contents
Contents
1.0 Introduction......................................................................................................................................13
1.1 Overview.............................................................................................................................13
1.2 ZT 7102 Features ...............................................................................................................13
1.3 Terms Used in This Document ...........................................................................................15
2.0 Hardware Specifications....................................................................................................................17
2.1 Overview.............................................................................................................................17
2.2 System Architecture............................................................................................................18
2.3 Backplane Connections ......................................................................................................18
2.3.1 Slot Connections....................................................................................................18
2.3.2 Chassis Sensor Connections.................................................................................19
2.3.3 Chassis FRU Device Connections.........................................................................19
2.3.4 Redundancy...........................................................................................................19
2.4 Power Modules ...................................................................................................................19
2.5 Fan Modules .......................................................................................................................19
2.6 Face Plate...........................................................................................................................20
2.6.1 Faceplate Features................................................................................................21
2.7 Mechanical..........................................................................................................................22
2.7.1 Board Dimensions and Weight ..............................................................................22
2.7.2 PCB Dimensions....................................................................................................22
2.8 Connectors .........................................................................................................................22
2.8.1 J1 Backplane Connector........................................................................................24
2.8.2 J2 Backplane Connector........................................................................................24
2.8.3 J3 Backplane Connector........................................................................................25
2.8.4 Backplane Pin Descriptions ...................................................................................26
2.8.5 JA1 Ethernet Port ..................................................................................................27
2.8.6 J6 Serial Port .........................................................................................................28
2.8.7 J7 Telco Alarm Connector .....................................................................................28
2.9 Electrical and Environmental ..............................................................................................29
2.9.1 CMM Power ...........................................................................................................29
2.9.2 Power Ramp Circuitry............................................................................................30
2.9.3 Operating Temperature .........................................................................................30
2.9.4 Reliability ...............................................................................................................30
2.9.5 Absolute Maximum Ratings ...................................................................................30
2.9.6 DC Operating Characteristics ................................................................................31
2.10 Onboard Switches ..............................................................................................................31
2.10.1 Switch Descriptions ...............................................................................................32
2.10.1.1 S1 (Alarm Cutoff and Board Reset) .......................................................32
2.10.1.2 SW1-1 (Password Reset) ......................................................................32
2.11 Processor and Chipset .......................................................................................................32
2.12 Memory...............................................................................................................................33
2.12.1 Removing the SODIMM.........................................................................................33
2.12.2 Installing Memory...................................................................................................33
2.13 Flash ...................................................................................................................................33
2.14 Dual Ethernet Controllers ...................................................................................................33
2.15 Serial I/O.............................................................................................................................33