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CHAPTER 2 Handling Devices
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Surface mounting type
The lead used in the surface mounting type package is thinner than that for the insertion type, so its shape is
easily changed. In line with the increased number of pins in the package, the lead pitch is also narrow, and
opening defects due to the lead change and short circuits due to the solder bridge can easily be caused, so
an appropriate mounting technique is required. We recommend the solder re-flow method, and implement
rank classification of the mounting conditions per product. Please mount according to the rank
classification of the our company recommendation.
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About keeping the semiconductor device
The plastic package is made of resin, so moisture is absorbed if left in a natural environment. When the
heat when mounting on the moisture absorption package joins, the decrease and the package crack of the
wet-proofing by the interfacial flaking off generation might be generated. Please note the following points.
• The be dewy of moisture happens to the product in the place with a rapid temperature change. Store it in
a place with minimum temperature fluctuations that avoid such an environment.
• The depository of the product recommends the use of a dry box. Please keep under the relative humidity
to 70% RH and the temperature to 5 to 30 °C.
• Silica-gel is used as a dry medicine in our company with a damp-proof and high as packing material of
the semiconductor device if necessary an aluminum laminate bag. Put the semiconductor device in the
laminated aluminum bag and close it tightly for storage.
• Please avoid the place where a lot of places and dust where the corrosively gas is generated.
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About the baking
The moisture absorption package can be dehumidified by executing the baking (heating dryness). Please
execute the baking by the condition which our company recommends.
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Static electricity
Please note the following points so that the semiconductor device may cause destruction by static electricity
easily.
• Please adjust the relative humidity of the working environment to 40% to 70% RH. Please examine the
use of TEL device (apparatus for generating ion) etc. if necessary.
• Earth the conveyer, soldering tank and iron, and peripheral incidental equipment to be used.
• In order to prevent electrocution of human body, try to earth through a ring or armlet with high
resistance (about 1MΩ), wear conductive clothing and shoes, and place a conductive mat on the floor to
minimize static build-up.
• Please execute the earth or the electrification prevention to the treatment device and meters.
• Avoid using materials that are easily charged, such as polystyrene foam, to store the assembled board.