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■ Precautions
The reliability of the semiconductor is affected by the peripheral temperature as mentioned before, and
other environmental conditions. Please note the following points.
●
Humidity
As for environment long-term use under the high humidity environment, something wrong with the leak
character might occur in not only the device but also printed wiring board, etc. Please consider the damp-
proof processing such as giving when the high humidity is assumed.
●
Static electricity discharge
The semiconductor device might cause the malfunction by being generate the electrical discharge in Kon
when electrified thing exists in high voltage near the device. For this case, please treat the prevention of
electrification or the prevention of the electrical discharge.
●
Corrosively gas, dust, and oil
If the device is used within a corrosive gas environment or where dust and oil, etc. may become attached,
the effect may be detrimental due to chemical reactions. Protective measures should be considered when
used under such an environment.
●
Radiation and cosmic ray
A general device does not assume the environment exposed to the radiation and the cosmic ray in the
design. Therefore, use this to shield.
●
Smoking and ignition
The device of the resin molding type is not nonflammability. Do not use the device near any ignitable
substance. In the event of smoke or fire may be generated toxic gases.
Additionally, please consult the section in charge of sales of our company about use under a special
environment for the idea.