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6. Package Specification
Package marking and outline drawings for the HDMP-3001 28x28mm, 160 pin PQFP.
Figure 25. Top View of Package
HDMP-3001
LLLLLLLLL-NNN
G YYWW R.R
CCCCC
LLLLLLLLL - WAFER LOT NUMBER
NNN - WAFER NUMBER
G - SUPPLIER CODE
YY - LAST TWO DIGITS OF YEAR
WW - TWO DIGIT WORK WEEK
R.R - DIE REVISION NUMBER
CCCCC - COUNTRY OF ORIGIN
Figure 24. Package Marking
e/2
b
-x-
DETAIL "A"
X = A, B, OR D
3
11.0 REF.
4X
N/4 TIPS
4
3
E/2
11.0 REF.
2.00 REF. DIA.
4 PLACES
SEE
DETAIL A
D
-D-
D/2
TOP VIEW
E
4
3
3
-D-
3
-A-
-B-
7