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4.1 Handling Precautions
4
PROCEDURES AND SETTINGS BEFORE SYSTEM
OPERATION
CHAPTER4 PROCEDURES AND SETTINGS BEFORE
SYSTEM OPERATION
4.1 Handling Precautions
(1) Do not drop or give a strong impact to the case.
(2) Do not remove the printed-circuit board of the module from the case.
Doing so may cause a failure.
(3) Be careful to prevent foreign matters such as cutting chips or wire chips
from entering the module.
Such foreign matter can cause a fire, failure, or malfunction.
(4) A protective film is attached to the module top to prevent foreign matter
such as wire chips from entering the module during wiring.
Do not remove the film during wiring.
Be sure to remove it for heat dissipation before system operation.
(5) Tighten the screws such as module fixing screws within the following
ranges.
Loose screws may cause short circuits, failures, or malfunctions.
(6) To mount the module, while pressing the module mounting lever located
in the lower part of the module, fully insert the module fixing projection
into the hole in the base unit and press the module until it snaps into
place.
Incorrect module mounting may cause a malfunction, failure, or drop of
the module.
(7) Always make sure to touch the grounded metal to discharge the
electricity charged in the body, etc., before touching the module.
Failure to do so may cause a failure or malfunctions of the module.
Table 4.1 Tightening torque
Screw Tightening torque range
Module fixing screw (M3 screw)
0.36 to 0.48N•m
Connector screw (M2.6 screw) 0.20 to 0.29N•m