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DEFINITY ECS Release 8.2 Maintenance for R8.2csi
555-233-119 Issue 1
April 2000
Maintenance Objects
3-1065TDM-BUS (TDM Bus)
3
Procedure 2
This procedure removes and re-inserts port circuit packs; one or several at a
time.
If all of the TDM Bus tests pass when the circuit pack is removed, but some of the
tests fail when the circuit pack is inserted, the circuit pack is the cause of the
problem and should be replaced. If some of the tests fail regardless of whether
the circuit pack is inserted or removed, the circuit pack is not the cause of the
problem (see Note). Repeat this procedure for each purple slot circuit pack in the
Port Network.
NOTE:
Of course, in a multiple failure situation, the circuit pack may be one cause
of the TDM Bus problem and there may be other failures that are causing
TDM Bus faults. Also, the circuit pack itself may not be the cause of the
problem, but the backplane pins may have been bent when the circuit pack
was inserted.
1. Remove port circuit packs which have failed the NPE Crosstalk Test (#6)
first. To find which circuit packs failed this test, display the Hardware Error
Log via the
display errors
command. Refer to the Maintenance
documentation of each port circuit pack that has port errors to check if
any error indicates the failure of the NPE Crosstalk Test.
2. If no circuit pack failed the NPE Crosstalk Test (#6), remove one or several
purple slot circuit packs.
3. Run the
test tdm P
command.
4. If any of the TDM Bus tests fail:
■ Check if the backplane pins in the removed circuit pack’s slot
appear to be bent.
■ If the backplane pins are bent, straighten or replace the pins,
re-insert the circuit pack, and do this procedure again for the same
circuit pack.
■ If the backplane pins are not bent, re-insert the circuit pack and do
this procedure for the next set of circuit packs.
5. If none of the TDM Bus tests fail:
■ Re-insert the circuit pack.
■ Run the
test tdm
system technician command.
■ If any of the TDM Bus tests fail, the re-inserted circuit pack is faulty.
Replace the circuit pack and do this procedure again for the new
circuit pack.
■ If none of the TDM Bus tests fail, then the problem has been fixed.